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I do not fear computers. I fear the lack of them."

—Isaac Asimov

MeitY’s Sushil Pal Stresses Components, Materials for India’s Semiconductor Drive

Sushil Pal, Joint Secretary, MeitY, with other participants at the Bharat Electronics Component Manufacturing Summit 2026 in New Delhi.

India needs to deepen its semiconductor ecosystem across components, materials, chemicals, equipment and advanced packaging as it works towards its broader electronics manufacturing ambitions, Sushil Pal, Joint Secretary, Ministry of Electronics and Information Technology (MeitY), said at the Bharat Electronics Component Manufacturing Summit 2026 in New Delhi on August 19. Addressing the summit, Pal said… Continue reading MeitY’s Sushil Pal Stresses Components, Materials for India’s Semiconductor Drive

India Lays Foundation for First 3D Chip Packaging Facility in Odisha

Union IT Minister Ashwini Vaishnaw and officials inspect the model of India’s first advanced 3D chip packaging facility during the foundation stone ceremony in Bhubaneswar on Monday.

India on Monday laid the foundation stone for its first advanced 3D chip packaging facility in Bhubaneswar, a ₹1,943 crore ($209 million) project expected to strengthen the country’s semiconductor ecosystem and begin production by 2028.