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Tag: semiconductor ecosystem

India Lays Foundation for First 3D Chip Packaging Facility in Odisha

Union IT Minister Ashwini Vaishnaw and officials inspect the model of India’s first advanced 3D chip packaging facility during the foundation stone ceremony in Bhubaneswar on Monday.

India on Monday laid the foundation stone for its first advanced 3D chip packaging facility in Bhubaneswar, a ₹1,943 crore ($209 million) project expected to strengthen the country’s semiconductor ecosystem and begin production by 2028.