India on Monday laid the foundation stone for its first advanced 3D chip packaging facility in Bhubaneswar, marking a significant step in the country’s efforts to build a domestic semiconductor ecosystem.

Heterogeneous Integration Packaging Solutions, the project is the Indian subsidiary of US based 3D Glass Solutions Inc and will serve as India’s first glass substrate based advanced semiconductor packaging unit in Info Valley in Khordha district of Odisha, with introduction of advanced 3D Heterogeneous Integration modules.

On Monday, Union IT Minister Ashwini Vaishnaw laid down the foundation stone in a ceremony in Odisha and claimed that with the launch of this project, the state is poised to become home to one of the world’s most sophisticated chip packaging technologies.

India has now become the world’s second-largest mobile phone manufacturer and emerged as the leading exporter of mobile phones in 2025”. Two semiconductor projects have already been approved for Odisha under the India Semiconductor Mission, while three more electronics and semiconductor-related proposals are in the pipeline. Discussions are also underway with major global companies, including Intel for future investments in the state,” said Vaishnaw at the event on Monday.

To be built at a cost of  ₹1,943 crore (roughly $209M), the project will focus on production of advanced chips to serve key sectors including aerospace, defense, artificial intelligence, 5G technologies and data centers.

Union IT Minister Vaishnaw also claimed that the project will also create many job opportunities for engineers, diploma holders, and ITI students. It will provide young people in Odisha with more opportunities to work and develop careers in high growth areas of modern technology.

By 2028, the facility is projected to begin production and achieve its full capacity within two years of that date (by the end of 2030).

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